Gapfill for device integration

TW202630937APending Publication Date: 2026-07-16APPLIED MATERIALS INC
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
APPLIED MATERIALS INC
Filing Date
2025-10-13
Publication Date
2026-07-16

Smart Images

  • Figure TWG2TA001068749_001
    Figure TWG2TA001068749_001
  • Figure TWG2TA001068749_002
    Figure TWG2TA001068749_002
  • Figure TWG2TA001068749_003
    Figure TWG2TA001068749_003
Patent Text Reader

Abstract

A method for dielectric gapfill includes forming a liner layer on inner surfaces of a lateral opening, filling the opening with a flowable dielectric layer on the liner layer by exposing the flowable dielectric layer to a steam, and densifying the flowable dielectric layer, forming a dielectric layer within the opening.
Need to check novelty before this filing date? Find Prior Art