Substrate processing apparatus and substrate processing method

Abstract

The present invention relates to a substrate processing apparatus and a substrate processing method capable of manufacturing semiconductor wafers. The substrate processing apparatus may include: a stage unit, on which a wafer is mounted; a gripper unit, which mounts the wafer onto the mounting surface of the stage unit; a constant voltage sensor unit, which measures the charged state of static electricity accumulated on the wafer; a static neutralization unit, which neutralizes the static electricity carried by the wafer; and a control unit, which controls the constant voltage sensor unit and the static neutralization unit, configured to neutralize the static electricity carried by the wafer based on the charged state of the wafer measured by the constant voltage sensor unit.

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