Semiconductor device and method of making a molded interposer with an embedded bridge module

Abstract

A semiconductor device has a bridge die. An electrical component is mounted to the bridge die to form a bridge module. The bridge module is disposed over a carrier. A conductive via is formed over the carrier. An encapsulant is deposited over the conductive via and bridge module. A first conductive layer is formed over the encapsulant, conductive via, and bridge module. The carrier is removed. A second conductive layer is formed over the encapsulant, conductive via, and bridge module opposite the first conductive layer. A first semiconductor die and second semiconductor die are disposed over the bridge module and encapsulant. The first semiconductor die is coupled to the second semiconductor die through the bridge die.

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