Packaging substrate and manufacturing method of packaging substrate

Abstract

The present disclosure relates to a packaging substrate and a method for manufacturing a packaging substrate. The packaging substrate according to the present disclosure includes a core layer comprising a glass core having first and second surfaces opposite each other and a cavity portion penetrating the glass core; a cavity module and a second insulating layer disposed in the cavity portion. The cavity module comprises: a plurality of electronic elements, a first insulating layer and a third insulating layer. The first insulating layer covers each of the electronic elements with a coating material. The first insulating layer is disposed on an entire surface or an entire surface except one surface of each of the electronic elements. The third insulating layer disposes to cover the electronic elements with a molding material. The second insulating layer is embedded in a portion of the cavity portion excluding the cavity module.

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