Manufacturing methods for components with solder bumps, mounting precursors, and mounting bodies

Abstract

A component with solder bumps includes: a substrate; and a plurality of electrodes disposed on the substrate and having solder bumps, wherein in a portion of the electrodes, the solder bumps are high bumps having a solder base formed on the electrode surface and a solder bump formed on the surface of the solder base, and in the remaining portions of the electrodes, the solder bumps are low bumps having a solder base formed on the electrode surface.

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