Neural Processor (NPU) Semiconductor Packages and Artificial Intelligence (AI) Processor Packages

Abstract

This invention provides a neural processor (NPU) semiconductor package and an artificial intelligence (AI) processor package. The NPU semiconductor package may include: a semiconductor package substrate; an NPU chip, which is rotated at a first angle relative to one side of the semiconductor package substrate according to a planar reference and is mounted on the semiconductor package substrate; and one or more memory chips, which are rotated at a second angle relative to one side of the semiconductor package substrate according to a planar reference and are mounted adjacent to the NPU chip on the semiconductor package substrate. The first and second angles are determined such that the size of the semiconductor package substrate is smaller than a specific size specification.