Flow control methods, equipment and media for spray systems

The flow control method in the spray device optimizes the mixing time of sulfuric acid and hydrogen peroxide to enhance photoresist removal efficiency by controlling inlet and outlet flow rates, achieving efficient and cost-effective substrate processing.

TW202631259APending Publication Date: 2026-08-01ACM RES (SHANGHAI) INC
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Patent Information

Application Number
TW114146296
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-29
Filing Date
2025-11-26
Publication Date
2026-08-01

AI Technical Summary

Technical Problem

Existing semiconductor substrate processing methods face challenges in ensuring that sulfuric acid and hydrogen peroxide are mixed in a spraying device for a predetermined time to achieve optimal photoresist removal efficiency.

Method used

A flow control method is implemented in a spray device to control the inlet flow rate by setting a target outflow rate and predetermined liquid level height, ensuring the mixing duration of sulfuric acid and hydrogen peroxide within the device for a second predetermined time, thereby achieving a better adhesive removal effect on the substrate surface.

Benefits of technology

The method ensures the formation of carboxylic acid at optimal concentrations and temperatures, enhancing the photoresist removal efficiency while reducing the amount of sulfuric acid used and minimizing process time and costs.

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Abstract

A flow control method, apparatus, and medium for a spray device are disclosed. The flow control method includes setting a target outflow rate at the outlet of the spray device; determining a predetermined liquid level within the spray device; introducing at least two chemical solutions into the inlet of the spray device to mix the two chemical solutions within the spray device to form a mixture, wherein the mixture is discharged from the outlet while the inlet is receiving the mixture; and controlling the inlet flow rate such that when the inlet duration is a first predetermined duration, the liquid level within the spray device increases to the predetermined liquid level, and the inlet flow rate is equal to the target outflow rate, and the outlet flow rate is close to or equal to the target outflow rate, so that the mixing duration of the mixture within the spray device is a second predetermined duration.
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