A composition of sheet-like copper particles and conductive resin containing them

TW202631282APending Publication Date: 2026-08-01MITSUI METAL CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW114141150
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-10-25
Filing Date
2025-10-23
Publication Date
2026-08-01
Patent Text Reader

Abstract

In the sheet-like copper particles of this invention, the number of grains observed and measured on average from the cross-section of the sheet-like copper particles using electron beam backscattering diffraction is between 150 and 2000. Viewed from above, with the longest line segment traversing the particle as the major axis and the perpendicular bisection of that major axis as the minor axis, the number of grains in view from above, relative to the product of the major and minor axis lengths (μm²), is between 4.5 and 40.0 grains / μm². The grain size is preferably between 0.2 μm and 1.3 μm. Viewed from above, it is preferable that the average size of grains in the peripheral region is smaller than the average size of grains located in the central region of the particle.
Need to check novelty before this filing date? Find Prior Art