Polyimide, polyimide powder, polyimide coatings, and polyimide films
A polyimide synthesized from specific diamine and tetracarboxylic acid dianhydride compounds provides solvent solubility, heat resistance, and mechanical properties, overcoming the limitations of PFAS materials by avoiding fluorine-containing groups and enhancing compatibility with reactive functional groups.
Patent Information
- Application Number
- TW114147741
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-11-25
- Filing Date
- 2025-12-05
- Publication Date
- 2026-08-01
AI Technical Summary
Existing polyimides contain trifluoromethyl or difluoromethylene groups, classified as PFAS materials, and lack compatibility with reactive functional groups, necessitating a polyimide that is solvent-soluble and exhibits excellent mechanical and heat-resistant properties without these groups.
A polyimide synthesized from specific diamine and tetracarboxylic acid dianhydride compounds, forming a film with excellent heat resistance, transparency, and mechanical properties, and compatibility with compounds like polyfunctional acrylates, without using fluorine-containing groups.
The polyimide achieves solvent solubility, excellent heat resistance, transparency, and mechanical properties, while maintaining compatibility with reactive functional groups, addressing the limitations of PFAS materials.