Thermosetting compositions and their cured products, photofusible compositions, methods for manufacturing structures, methods for manufacturing semiconductor devices, and polythiol compounds.
The introduction of hydroxyl groups into polythiol compounds in a thermosetting composition improves film-forming properties, allowing the composition to be melted by light irradiation and removed with an aqueous solvent, addressing the insufficient film-forming issues of conventional compositions.
TW202631877APending Publication Date: 2026-08-01RESONAC CORP
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Patent Information
- Application Number
- TW114130122
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-08-09
- Filing Date
- 2025-08-07
- Publication Date
- 2026-08-01
AI Technical Summary
Technical Problem
Conventional thermosetting compositions have insufficient film-forming properties when coated onto substrates and struggle to achieve good resin films.
Method used
A thermosetting composition comprising polythiol compounds with disulfide bonds and hydroxyl groups, cyclic ether compounds with polyether groups, curing accelerators, and photoradical generators, which can be melted by light irradiation and have improved film-forming properties due to the introduction of hydroxyl groups.
Benefits of technology
The composition forms a cured product that can be melted by light irradiation and removed with an aqueous solvent, exhibiting excellent film-forming properties.
✦ Generated by Eureka AI based on patent content.
Abstract
This invention relates to a thermosetting composition and its cured product. The thermosetting composition contains a polythiol compound having disulfide bonds and hydroxyl groups, a cyclic ether compound having polyether groups and two or more cyclic ether groups, a curing accelerator, and a photoradical generator.
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