Adhesive film, adhesive film with metal layer, component for wiring formation, method for forming wiring layer and component for wiring formation

The adhesive film with a metal layer, composed of epoxy and phenolic resin with conductive particles, addresses the complexity of conductive layer formation in component-embedded substrates by enhancing heat resistance and toughness, ensuring reliable connectivity under high temperatures.

TW202631931APending Publication Date: 2026-08-01RESONAC CORP
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Patent Information

Application Number
TW114146833
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-03
Filing Date
2025-12-01
Publication Date
2026-08-01

AI Technical Summary

Technical Problem

Existing methods for manufacturing component-embedded substrates are complex due to the repetitive processes required to form conductive layers, and adhesives with resin designs for improved heat resistance struggle to enhance film toughness, leading to issues like poor conductivity, expansion, peeling, and increased connection resistance under high-temperature environments.

Method used

An adhesive film with a metal layer containing epoxy resin and phenolic resin, along with conductive particles, is used to form a wiring layer by heating and pressing onto a substrate, providing heat resistance, film toughness, and improved connectivity.

Benefits of technology

The adhesive film with a metal layer offers high glass transition temperature, low thermal expansion, and enhanced film toughness, simplifying the wiring formation process while maintaining conductivity and reducing connection resistance.

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Abstract

An adhesive film comprising epoxy resin and phenolic resin, wherein the epoxy equivalent of the epoxy resin is 150 g / eq or less. An adhesive film with a metal layer comprising a metal layer and an adhesive layer disposed on the metal layer, wherein the adhesive layer comprises epoxy resin and phenolic resin, and the epoxy equivalent of the epoxy resin is 150 g / eq or less. A wiring forming component wherein the adhesive layer and the metal layer are separately disposed, and the adhesive layer can be bonded to the metal layer in use, wherein the adhesive layer of the wiring forming component comprises epoxy resin and phenolic resin, and the epoxy equivalent of the epoxy resin is 150 g / eq or less.
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