Hardening adhesive composition and laminate

A curable adhesive composition with balanced thermosetting and thermoplastic components addresses the inefficiencies of existing adhesives by providing rapid curing and high heat resistance, shortening manufacturing processes for heat-resistant composite components.

TW202631944APending Publication Date: 2026-08-01TOMOEGAWA CORP
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Patent Information

Application Number
TW114131402
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-09-17
Filing Date
2025-08-18
Publication Date
2026-08-01

AI Technical Summary

Technical Problem

Existing adhesive technologies for bonding dissimilar materials in composite components for heat-resistant applications are inefficient, with thermoplastic resins being too quick but lacking heat resistance, and thermosetting resins requiring lengthy curing times, thus prolonging manufacturing processes.

Method used

A curable adhesive composition combining thermosetting and thermoplastic components, with specific ratios and properties to achieve rapid curing and high bonding strength, including a thermosetting component selected from epoxy resin, bismaleimide resin, or phenolic resin, and a thermoplastic component such as uncrosslinked acrylic rubber or polyolefin elastomer, along with a curing agent like aromatic diamines or imidazoles, ensuring a heat release ratio less than 1.0 and a storage modulus of 1×10⁵ Pa after heat treatment.

Benefits of technology

The composition allows for a significant reduction in manufacturing time while maintaining high bonding strength and heat resistance, achieving bonding strengths above 3 N/cm and curing within 5 minutes at 150°C.

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Abstract

This invention provides a curable adhesive composition and a laminate that can shorten the process time when manufacturing composite components for heat-resistant applications. The curable adhesive composition of this invention comprises a thermosetting component and a thermoplastic component. The curable adhesive composition has a heat release of 10 mJ / mg or more as measured by DSC at 25~300°C before heat treatment, a heat release ratio (heat release after heat treatment / heat release before heat treatment) of less than 1.0 before and after heat treatment at 150°C / 5min, and a storage modulus of elasticity of 1×10⁵ Pa or more as measured by DMA at 150°C after heat treatment at 150°C / 5min.
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