Transparent conductive film, transparent conductive film structure, and manufacturing method of transparent conductive film

A transparent conductive film with a first layer epitaxially bonded to a hexagonal tungsten bronze film addresses the high resistivity and cost issues of ITO, achieving low resistivity and high transmittance through aligned crystal orientation and stress reduction.

TW202632030APending Publication Date: 2026-08-01SUMITOMO METAL MINING CO LTD
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Patent Information

Application Number
TW114140010
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-10-18
Filing Date
2025-10-16
Publication Date
2026-08-01

AI Technical Summary

Technical Problem

Existing transparent conductive films, such as Indium Tin Oxide (ITO), are expensive and have resistivity values that are higher than desired for industrial applications, necessitating improvements in conductivity and cost-effectiveness.

Method used

A transparent conductive film structure comprising a first layer epitaxially bonded to a hexagonal tungsten bronze (HTB) film, where the first layer acts as a buffer to reduce stress and improve conductivity, and the HTB film provides high conductivity through aligned crystal orientation.

Benefits of technology

The film achieves low resistivity of 1.01×10⁻³ Ω·cm or less, enhancing conductivity and reducing production costs while maintaining optical properties, with visible light transmittance of 20% to 90% and improved productivity.

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Abstract

A transparent conductive film has a first layer and a second layer, wherein the second layer is directly deposited on the first layer, the second layer includes an HTB film, which is a hexagonal tungsten bronze film, and at least a portion of the first layer is epitaxially bonded to the HTB film of the second layer. none
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