Planarization method, planarization system, and article manufacturing method

The planarization system addresses inefficiencies in existing technologies by using multiple processing devices to form planarization films and spin-coat liquid films, achieving high-throughput and consistent flatness for substrates with varying specifications.

TW202632426APending Publication Date: 2026-08-01CANON KK
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Patent Information

Application Number
TW114139473
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-10-17
Filing Date
2025-10-14
Publication Date
2026-08-01

AI Technical Summary

Technical Problem

Existing planarization technologies are inefficient in achieving high throughput and consistent flatness for substrates, particularly at the nanoscale, due to lengthy processing times and high adhesion forces, limiting the ability to process multiple substrates sequentially.

Method used

A planarization system utilizing multiple processing devices that perform at least two steps: forming a planarization film by contacting a cover plate with a curable composition and spin-coating a liquid film, allowing for parallel processing and selective use of methods like droplet placement, spin coating, and heat treatment to achieve desired flatness.

Benefits of technology

The system significantly reduces processing time and enhances substrate flatness, enabling high-throughput production of substrates with varying flatness requirements by selectively employing different planarization techniques.

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Abstract

In a planarization method using a planarization system including a plurality of processing apparatuses, the planarization system is configured to be able to perform, using the plurality of processing apparatuses, at least two steps of forming a first planarizing film by bringing a superstrate into contact with a curable composition placed on a first substrate, and spin coating a liquid film of a curable composition on a second substrate using a spin coat method. The planarization method includes performing any one of the at least two steps to perform planarization of the first substrate or the second substrate.
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