Lower electrode assembly, plasma treatment equipment and its voltage control method

By connecting a capacitor in series to the circuit supplying DC pulse signals to the focusing ring, the voltage difference between the substrate and focusing ring is adjusted, addressing non-uniform etching and arc discharge risks in plasma processing equipment.

TW202632749APending Publication Date: 2026-08-01ADVANCED MICRO FAB EQUIP INC CHINA
0 Cites 0 Cited by

Patent Information

Application Number
TW114151675
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-01-21
Filing Date
2025-12-29
Publication Date
2026-08-01

AI Technical Summary

Technical Problem

Traditional plasma processing equipment struggles to achieve precise control over ion energy distribution during etching due to varying accelerating electric fields, leading to non-uniform etching and a risk of arc discharge between the substrate and focusing ring.

Method used

A lower electrode assembly with a capacitor connected in series to the circuit supplying DC pulse signals to the focusing ring, adjusting the voltage change slope to reduce the voltage difference between the substrate and focusing ring, thereby minimizing the risk of arc discharge.

Benefits of technology

The solution provides precise control over the rate of voltage change, improving etching uniformity and reducing the risk of arc discharge, enhancing the safety and longevity of the lower electrode assembly.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

This invention provides a lower electrode assembly, a plasma processing device, and a voltage control method thereof. A first DC pulse voltage is coupled to a first circuit of a focusing ring through a first bias power supply, and a first capacitor is connected in series. The capacitance value of the first capacitor is used to adjust the first slope corresponding to the voltage change of the focusing ring, thereby reducing the voltage difference between the substrate and the focusing ring and effectively reducing the risk of arc discharge between the substrate and the focusing ring.
Need to check novelty before this filing date? Find Prior Art