Semiconductor device

TW202633173APending Publication Date: 2026-08-01SAMSUNG ELECTRONICS CO LTD
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Patent Information

Application Number
TW114138907
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-19
Filing Date
2025-10-09
Publication Date
2026-08-01

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    Figure TWG2TA001070780_003
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Abstract

Disclosed is a semiconductor device comprising a substrate, a bit line that extends in a first direction on the substrate, a mold structure on the bit line and extending in a second direction that intersects the first direction, a vertical semiconductor pattern on a top surface of the bit line and a lateral surface of the mold structure, a gate electrode spaced apart from the mold structure and facing the vertical semiconductor pattern and extending in the second direction that intersects the bit line, and a node contact on the vertical semiconductor pattern. The vertical semiconductor pattern comprises a first part, a second part, and a third part that are sequentially on the bit line. A distance that the second part protrudes from the lateral surface of the mold structure is more than a distance that the first part and the third part protrude from the lateral surface.
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