Substrate electroplating apparatus, electroplating equipment and substrate electroplating method
The substrate electroplating apparatus addresses the challenges of uniformity and efficiency on large panels by flowing the solution parallel to the plating surface, using a flow equalization system, and adjusting substrate posture, resulting in improved plating uniformity and reduced breakage.
TW202633260APending Publication Date: 2026-08-01ACM RES (SHANGHAI) INC
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Patent Information
- Application Number
- TW114147190
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-09
- Filing Date
- 2025-12-02
- Publication Date
- 2026-08-01
AI Technical Summary
Technical Problem
The challenge of achieving uniform electroplating and improving mass transfer efficiency on large-sized panels in panel-level packaging is exacerbated by warping and deformation, leading to uneven plating and potential fragmentation.
Method used
A substrate electroplating apparatus with a tank design that allows the electroplating solution to flow parallel to the plating surface, utilizing a flow equalization system and pressure adjustment to maintain substrate verticality, and incorporating a diffuser plate for uniform electric field distribution.
Benefits of technology
This design enhances plating uniformity, increases mass transfer efficiency, and prevents substrate breakage by maintaining a stable flow field and adjusting substrate posture during electroplating.
✦ Generated by Eureka AI based on patent content.
Abstract
A substrate electroplating apparatus, electroplating equipment, and substrate electroplating method are disclosed. The substrate electroplating apparatus includes: a tank having an inlet, an outlet, and a plating chamber, the plating chamber being used to contain electroplating solution and configured as a closed chamber during electroplating; a substrate holding element for holding the substrate and holding the substrate in a vertical position inside the plating chamber during electroplating, wherein the substrate has a plating surface; an anode located inside the plating chamber and facing the plating surface; the electroplating solution is configured to flow from one side of the plating chamber through the inlet along a first direction to the other side of the plating chamber and then be discharged from the outlet to the plating chamber, thereby forming a flow field parallel to the plating surface on the plating surface, wherein the first direction is a direction parallel to the plating surface.
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