Chemical mechanical polishing apparatus and method of chemical mechanical polishing

TW202633301APending Publication Date: 2026-08-01APPLIED MATERIALS INC
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Patent Information

Application Number
TW115110912
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2019-02-20
Filing Date
2020-02-13
Publication Date
2026-08-01

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Abstract

A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature control system including a source of a fluid medium and one or more openings positioned over the platen and separated from the polishing pad and configured for the fluid medium to flow onto the polishing pad to heat or cool the polishing pad.
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