Substrate holding device, substrate handling robot equipped with the substrate holding device, reversing device, and substrate holding method

The substrate holding device with adjustable rods and adhesion detection addresses the challenge of gripping complex-warped substrates by dynamically adjusting angles for secure adhesion, enhancing handling reliability.

TW202633342APending Publication Date: 2026-08-01RORZE CORP
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Patent Information

Application Number
TW114139935
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-10-18
Filing Date
2025-10-16
Publication Date
2026-08-01

AI Technical Summary

Technical Problem

Existing substrate holding devices struggle to reliably grip substrates with complex warping shapes, particularly when oriented in directions other than those accounted for by previous technologies, leading to potential adhesion failures and instability during handling and transport.

Method used

A substrate holding device with multiple rods and an angle-changing mechanism that adjusts the rods' angle relative to the horizontal plane, combined with an adhesion detection unit to ensure secure adhesion, allowing for reliable gripping of warped substrates by altering the angle of the rods based on vacuum pressure feedback.

Benefits of technology

The device ensures stable and secure handling of substrates with complex warping by dynamically adjusting the angle of the rods to find optimal adhesion points, reducing the risk of failure and improving transport reliability.

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Abstract

A substrate holding apparatus and a substrate handling method are provided for holding warped substrates (e.g., semiconductor substrates, liquid crystal substrates, or other thin-plate substrates), and a substrate handling robot and a reversing device using these apparatus and methods. The substrate holding apparatus includes: a plurality of rods (30) having a plurality of separately arranged suction portions (33) for attracting and holding a semiconductor wafer or other substrate (60); a base (12) supported in such a manner that the angle of at least one of the plurality of rods (30a, 30b) relative to the horizontal plane in its length direction can be changed; and an angle changing portion (15, 20-25) for changing the aforementioned angle of the rods (30a, 30b). By using the angle changing portion (15, 20-25) to change the tilt angle of the rods (30a, 30b) in the length direction, the suction point of the substrate is determined, thereby reliably holding the substrate.
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