Method for manufacturing a substrate with through electrodes

By attaching a laminate with a metal layer and electroplating directly, the method simplifies the manufacturing of substrates with through electrodes, reducing the number of steps required.

TW202633456APending Publication Date: 2026-08-01NISSAN CHEM CORP
0 Cites 0 Cited by

Patent Information

Application Number
TW114138806
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-10-10
Filing Date
2025-10-08
Publication Date
2026-08-01

AI Technical Summary

Technical Problem

Existing methods for manufacturing through electrodes in substrates require complex steps involving the formation of a seed layer for electroplating, which complicates the process.

Method used

A method involving attaching a laminate with a metal layer to the substrate, forming a through-hole, and electroplating the metal layer as a cathode to fill the hole, while using a second support substrate to simplify the manufacturing process.

Benefits of technology

This method allows for the production of substrates with through electrodes in fewer steps, reducing complexity and potentially improving efficiency.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

The present invention is a method for manufacturing a substrate having a through electrode, comprising: a first step of attaching a first laminate having a first support substrate and a first metal layer to the substrate from one side of the substrate, such that the first metal layer is located on the substrate side, and then peeling the first support substrate from the first metal layer; a second step of forming a through hole through the first metal layer and the substrate on the substrate before the first metal layer is attached; a third step of attaching a second laminate having a second support substrate and a second metal layer to the substrate from the other side of the substrate before the through hole is formed, such that the second metal layer is located on the substrate side; and a fourth step of electroplating the second metal layer as a cathode to fill the through hole with metal.
Need to check novelty before this filing date? Find Prior Art