Sensor package structure
The sensor packaging structure addresses air bubble issues in existing designs by using angled molded packages and a dispensing ramp to expel bubbles, improving yield.
TW202633513AActive Publication Date: 2026-08-01TONG HSING ELECTRONICS IND LTD
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Patent Information
- Application Number
- TW114101587
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-01-15
- Publication Date
- 2026-08-01
- Estimated Expiration
- 2045-01-14
AI Technical Summary
Technical Problem
Existing sensor packaging structures that employ both molded and liquid encapsulated packages are prone to air bubble formation, leading to reduced yield.
Method used
A sensor packaging structure design featuring a molded package with specific angles and a dispensing ramp, combined with an encapsulating colloid, prevents air bubble formation by allowing them to float upwards and be expelled during the dispensing process.
Benefits of technology
The design effectively minimizes air bubbles within the packaging colloid, enhancing the yield of the sensor packaging structure.
✦ Generated by Eureka AI based on patent content.
Abstract
The present invention provides a sensor package structure, which includes a substrate, a sensor chip mounted on the substrate, a plurality of metal wires connected to the substrate and the sensor chip, a molding compound formed on the substrate and surrounding the sensor chip and the metal wires, a ring-shaped supporting layer formed on a flat top surface of the molding compound, a light-permeable sheet disposed on the ring-shaped supporting layer, and an encapsulating adhesive that is formed on a slanting surface of the molding compound in a dispensing manner. The slanting surface and the substrate have an angle therebetween that is less than
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