Substrate processing apparatus, substrate processing method and memory medium

TW202633725APending Publication Date: 2026-08-16TOKYO ELECTRON LTD
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Patent Information

Application Number
TW115117805
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2020-09-04
Filing Date
2021-08-31
Publication Date
2026-08-16

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    Figure TWG2TA001073620_003
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Abstract

[Problem] Forming a coating film on the periphery and side surface of a substrate. [Solution] A substrate processing apparatus for forming a coating film (R) on the periphery of the surface and side surface of a substrate, comprising: a substrate holding section for rotatably holding the substrate; a first liquid supply section for supplying a first liquid to the periphery of the substrate containing the substrate; a portion removal section for removing at least a portion of the first liquid adhering to the surface and side surface of the substrate from the first liquid supplied to the substrate; a second liquid supply section for supplying a second liquid for forming the coating film to the surface and side surface of the substrate; a first liquid removal section for removing the first liquid remaining on the substrate to which the second liquid is adhered; and a control section for controlling the substrate holding section, the first liquid supply section, the portion removal section, the second liquid supply section, and the first liquid removal section.
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