Powder for additive manufacturing

TW202633728APending Publication Date: 2026-08-16JX NIPPON MINING & METALS CORP
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Patent Information

Application Number
TW114130139
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-09-30
Filing Date
2025-08-07
Publication Date
2026-08-16

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Abstract

The present invention relates to a powder for lamination forming, comprising copper-containing particles containing Cu, and a coating layer covering at least a portion of the area surrounding the copper-containing particles, the coating layer containing Y, and the average coverage of the coating layer around the copper-containing particles being 5% or more. none
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