Laser processing apparatus, substrate processing system and laser processing method

Abstract

The laser processing apparatus of the present invention irradiates a first laser beam onto a first pre-peeling surface defined at the interface of a first substrate and a second substrate that are joined together. The laser processing apparatus includes: a holding section for holding a laminated substrate composed of the first substrate and the second substrate; an irradiation section for irradiating the first laser beam onto the first pre-peeling surface of the laminated substrate held by the holding section; a moving section for moving the holding section relative to the irradiation section to form a plurality of irradiation points of the first laser beam at intervals on the first pre-peeling surface; an imaging section for capturing an infrared image of the first pre-peeling surface of the laminated substrate held by the holding section; and a control circuit. The control circuit determines whether the reduction in peeling force on the first pre-peeling surface is satisfactory based on the infrared image captured by the imaging section after irradiation with the first laser beam.

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