Laser processing apparatus and method based on superlens

TW202633730APending Publication Date: 2026-08-16WESTLAKE INSTRUMENTS (HANGZHOU) TECHNOLOGY CO LTD
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Patent Information

Application Number
TW115116986
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-08-13
Filing Date
2026-04-29
Publication Date
2026-08-16

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Abstract

This disclosure relates to a laser processing apparatus and method based on a superlens. A superlens is configured and placed on the emission side of the laser processing head to scan the surface of the sample to be laser processed, acquire sample surface data, configure the height of the superlens corresponding to the sample position, and output a processing laser. The processing laser is focused by the superlens and acts on the sample to form a modified layer. The apparatus uses a processing stage with a translation mechanism to place the sample to be laser processed and make the sample move on a horizontal plane. A laser unit emits and shapes the laser. A focusing module with a superlens works in conjunction with the translation mechanism and the laser unit, and is controlled by a controller.
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