Laser drilling system and method for selective removal of insulating layers

TW202633734APending Publication Date: 2026-08-16ABSOLICS INC
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Patent Information

Application Number
TW114151266
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-31
Filing Date
2025-12-26
Publication Date
2026-08-16

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Abstract

The embodiment relates to a laser drilling system and a method for selectively removing an insulating layer, and comprises: a workpiece including a metal layer and an insulating layer disposed on the metal layer; a stage on which the workpiece is placed; an optical delivery system disposed on the stage and configured to deliver laser light to the insulating layer; a laser beam generator connected to the optical delivery system and configured to output laser light; a blowing-suction device disposed between the workpiece and the optical delivery system; a monitoring-inspection device configured to inspect the surface shape of the workpiece; and a control unit configured to control the laser light generated by the laser beam generator and / or the optical delivery system based on the surface shape information, wherein the optical delivery system controls the laser light by means of a diffractive optical system.
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