Polishing pad, preparation method thereof and method for preparing a semiconductor device using the same
TW202633740APending Publication Date: 2026-08-16SK ENPULSE CO LTD
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Patent Information
- Application Number
- TW114138858
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-10-28
- Filing Date
- 2025-10-08
- Publication Date
- 2026-08-16
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Abstract
According to an embodiment of the present invention, there is provided a polishing pad, which comprises a polishing layer comprising a first side and a second side, as an opposite side, and having a non-foamed structure, wherein the polishing layer comprises a plurality of holes extending from the first side toward the second side and not penetrating the polishing layer, and each of the plurality of holes has a width of
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