Method for recovering a surface of a polishing pad and polishing pad with low metal contamination

Abstract

The present invention provides a method for surface restoration of a polishing pad, comprising adjusting the polishing surface of the polishing pad, wherein the adjustment comprises applying steam at 80°C to 110°C to the polishing surface, and when the polishing surface is analyzed by inductively coupled plasma optical emission spectrometry (ICP-OES), the increase in titanium (Ti) content after the adjustment relative to the amount before the adjustment is 100 ppm or less. There is provided a method for surface restoration of a polishing pad, which comprises conditioning the polishing surface of a polishing pad, wherein the conditioning comprises applying steam of 80℃ to 110℃ to the polishing surface, and when the polishing surface is analyzed by inductively coupled plasma-optical emission spectrometry (ICP-OES), the increase in the content of titanium (Ti) after the conditioning relative to before the conditioning is 100 ppm or less.

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