Semiconductor device producing sheet

Abstract

It is an object to provide a semiconductor device production sheet configured to suppress an adhesive tape from having winding marks (transfer marks) when being wound. Provided is a semiconductor device production sheet including at least one strip-shaped constituent unit, in which each of the at least one strip-shaped constituent unit includes: a release liner having a strip shape; a plurality of dicing tape equipped adhesive films laminated on one surface of the release liner and aligned in a row at intervals in a longitudinal direction of the release liner; and an outside film laminated directly on the one surface of the release liner and arranged away from an outer peripheral edge of each of the plurality of dicing tape equipped adhesive films, each of the plurality of dicing tape equipped adhesive films includes: a dicing tape having a laminated structure of a backing material layer and an adhesive layer; and an adhesive film disposed between the dicing tape and the release liner and releasably contacting the adhesive layer, the dicing tape is arranged to extend beyond the outer peripheral edge of each corresponding adhesive film to cover the adhesive film, for each of the at least one strip-shaped constituent unit, the outside film is arranged on one side and an other side in a width direction of the release liner, and includes a first outside film and a second outside film away in the width direction from each other, for each of the at least one strip-shaped constituent unit, the first outside film and the second outside film each include a plurality of projections projecting inward in the width direction and aligned in the longitudinal direction between the plurality of dicing tape equipped adhesive films adjacent to each other in the longitudinal direction, and the first outside film and the second outside film are arranged to have distal ends of the plurality of projections facing each other in the width direction at a distance therebetween of

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