Composition for forming a separation layer and laminate

Abstract

The objective of this invention is to provide a separation layer forming composition capable of forming a separation layer that allows a support substrate to separate from a laminate upon irradiation with light and improves heat resistance, and a laminate having the separation layer formed therefrom. This invention employs a separation layer forming composition for forming a separation layer 12 in a laminate 10 having a separation layer 12 between a first layer and a second layer. The first layer is a support substrate 11 that allows light to pass through, and the separation layer 12 is a layer that deteriorates upon irradiation with light from the support substrate 11 side, thereby allowing the support substrate 11 to separate from the laminate 10. The separation layer forming composition contains an epoxy resin (P), a light absorber having absorption at wavelengths between 300 nm and 1300 nm, and at least one acid generator selected from the group consisting of a thermo-acid generator and a photo-acid generator. The curing temperature of the separation layer forming composition is 200°C or higher, resulting in a 1% weight reduction temperature.

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