Multilayer, method for manufacturing multilayer, and method for manufacturing semiconductor substrate after processing

Abstract

This invention provides a laminate containing an adhesive layer for temporarily bonding a semiconductor substrate and a support substrate, wherein the adhesive layer can be formed in the form of a thin film. This laminate allows for a simple and easy process of peeling off the semiconductor substrate and the support substrate, and a cleaning process of removing the adhesive layer remaining on the semiconductor substrate after peeling, thus making it practically effective. The laminate system of this invention includes a semiconductor substrate, a support substrate, and an adhesive layer formed in contact with the semiconductor substrate. The adhesive layer is used to temporarily bond the semiconductor substrate and the support substrate. The adhesive layer contains an organic resin but does not contain silicone resin. The film thickness of the adhesive layer is 200 nm or more and 20 μm or less.

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