Methods for manufacturing resin films, metal-coated laminates, circuit boards, and resin films.

TW202633783APending Publication Date: 2026-08-16DAIKIN INDUSTRIES LTD
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Patent Information

Application Number
TW114143632
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-08
Filing Date
2025-11-07
Publication Date
2026-08-16
Patent Text Reader

Abstract

The purpose of this invention is to provide a resin film that can maintain sufficient adhesion strength to other materials even under high-temperature conditions. This invention relates to a resin film comprising at least a fluororesin, wherein the water contact angle of the surface of the resin film is 55° to 105°, and before and after heat treatment at 180°C for 10 minutes, the color difference Δb* of the surface of the resin film in the CIE1976 (L*, a*, b*) color space, measured according to JIS Z8781-4:2013, is 0.5 or less, and the color difference ΔE* is 0.8 or less. none
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