Delivery method for vacuum pump

Abstract

A method includes receiving a demand for delivering a vacuum pump in a wafer fabrication facility. The vacuum pump in a pump storage region of the wafer fabrication facility is assigned. A pump delivery tool is set up on a top surface of the assigned vacuum pump. The pump delivery tool includes length adjustment mechanisms, width adjustment mechanisms, and first fixing elements. The width adjustment mechanisms and the length adjustment mechanisms are over the top surface of the assigned vacuum pump. The width adjustment mechanisms are assembled to the length adjustment mechanisms. The width adjustment mechanisms are substantially perpendicular to the length adjustment mechanisms. The first fixing elements secure the length adjustment mechanisms to the width adjustment mechanisms. The assigned vacuum pump is delivered by using the pump delivery tool in the wafer fabrication facility.

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