Silica abrasive particle and slurry composition for chemical mechanical polishing comprising the same

TW202633838APending Publication Date: 2026-08-16DONGJIN SEMICHEM CO LTD
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Patent Information

Application Number
TW114143916
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-06
Filing Date
2025-11-11
Publication Date
2026-08-16

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Abstract

This invention relates to silicon dioxide polishing particles and a slurry composition containing the same for chemical mechanical polishing, which has a high polishing speed while suppressing damage to the polished object.
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