Radiosensitive linear components, patterning methods and compounds
TW202633869APending Publication Date: 2026-08-16JSR CORPORATION
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Patent Information
- Application Number
- TW114149803
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-07
- Filing Date
- 2025-12-18
- Publication Date
- 2026-08-16
Abstract
The present invention aims to provide a radiosensitive linear composition, a patterning method, and a compound that, during resist patterning, can fully exert its sensitivity, exposure margin, depth of focus, pattern rectangularity, storage stability, development defect performance, CDU, and pattern circularity. The radiosensitive linear composition comprises: a polymer (A), a compound (B) represented by the following formula (1), an acid diffusion control agent (C), and a solvent (S). (In formula (1), Q is a quinone structure. M+ is a monovalent organic cation.)
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