Radiosensitive linear components, patterning methods and compounds

TW202633869APending Publication Date: 2026-08-16JSR CORPORATION
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Patent Information

Application Number
TW114149803
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-07
Filing Date
2025-12-18
Publication Date
2026-08-16
Patent Text Reader

Abstract

The present invention aims to provide a radiosensitive linear composition, a patterning method, and a compound that, during resist patterning, can fully exert its sensitivity, exposure margin, depth of focus, pattern rectangularity, storage stability, development defect performance, CDU, and pattern circularity. The radiosensitive linear composition comprises: a polymer (A), a compound (B) represented by the following formula (1), an acid diffusion control agent (C), and a solvent (S). (In formula (1), Q is a quinone structure. M+ is a monovalent organic cation.)
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