Thermosetting resin compositions and their uses

Abstract

The purpose of this invention is to provide a thermosetting resin composition with high glass transition temperature, excellent resistance to tracking and long-term heat resistance. The solution is a thermosetting resin composition comprising: (A) an aliphatic bismaleimide compound as shown in formula (1) below (in formula (1), A is a divalent aliphatic hydrocarbon group with 5 to 12 carbon atoms, which can be linear, branched, or cyclic); (B) a phenolic alkyl epoxy resin; (C) an epoxy resin containing siloxane bonds; (D) an epoxy resin curing agent; (E) an inorganic filler; and (F) a curing accelerator.

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