Photosensitive resin composition, photosensitive resin film, printed circuit board and manufacturing method thereof, and semiconductor package

Abstract

A photosensitive resin composition, a photosensitive resin film using the photosensitive resin composition, a printed circuit board and a method for manufacturing the same, and a semiconductor package, wherein the photosensitive resin composition comprises: (A) a photopolymerizable compound having an ethylene unsaturated group and an acidic substituent; (B) one or more selected from the group consisting of a silane coupling agent having (meth)acrylic and alkoxysilyl groups and components derived from the silane coupling agent; (C) a thermosetting resin; and (D) an organic peroxide; wherein the aforementioned (C) thermosetting resin comprises one or more selected from the group consisting of maleimide resin and allyl resin. none

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