Photosensitive resin laminate, photosensitive element and pattern forming method

Abstract

The photosensitive resin laminate of the present invention comprises a temporary support and a photosensitive resin layer on the temporary support; the average thickness of the photosensitive resin layer is 16 μm or less; the photosensitive resin layer comprises a photosensitive resin composition containing the following substances: (A) an adhesive polymer, (B) a photopolymerizable compound having ethylene unsaturated bonds, and (C) a photopolymerization initiator; (A) the adhesive polymer is a copolymer containing a weight average molecular weight of 30,000 or less; relative to 100 parts by mass of the total amount of (A) the adhesive polymer and (B) the photopolymerizable compound, the content of (C) the photopolymerization initiator is 5.0 parts by mass or more; the absorbance of each 1 μm thickness of the aforementioned photosensitive resin composition layer for light with a wavelength of 365 nm or 402 nm is greater than 0.005 and less than 0.040.

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