resin composition

Abstract

To provide resin compositions that yield hardened materials with low dielectric tangent, suppress the increase of minimum melt viscosity and the reduction of residual solvent content, and exhibit excellent temporary adhesion. Solution: A resin composition comprising: (A) epoxy resin, (B) an active ester-based curing agent, (C) an inorganic filler, and (D-1) a ketone-based organic solvent with a boiling point of 150°C or higher, wherein the ratio of the amount of component (A) to component (B) ([total number of active groups in component (B)] / [total number of epoxy groups in component (A)]) is 0.7 or higher and 1.6 or lower; when the non-volatile components in the resin composition are 100% by mass, the content of component (C) is 65% by mass or higher; when all organic solvents contained in the resin composition are 100% by mass, the content of component (D-1) is 10% by mass or higher and 50% by mass; and when all components in the resin composition are 100% by mass, the content of component (D-1) is 1.5% by mass or higher and 10% by mass or lower.

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