Resin components, adhesives, sealants, hardeners, electronic components and semiconductor devices

Abstract

This invention provides a resin composition that can suppress exudation during thermosetting on a ceramic substrate. The resin composition comprises: (A) an epoxy resin, (B) a hardener, and (C) a rheology control agent, wherein component (C) has the following characteristic (1). Characteristic (1): When 1 μL of the composition comprising 99 g of bisphenol F type epoxy resin and 1 g of component (C) is formed at room temperature on the tip of a catheter needle, and the contact angle θ1 after 6 seconds of dripping onto a ceramic substrate is set to 100%, the contact angle θ3 after 5 minutes from the time of dripping is 88%–100%.