Liquid compression molding materials, hardened materials, electronic components and semiconductor devices

Abstract

[Problem] The legibility of printed text formed by laser marking is excellent. [Solution] A liquid compression molding material comprising: (A) epoxy resin, (B) a hardener, (C) an inorganic filler, and (D) a colorant, wherein the absorbance measured using a photometer under the following absorbance measurement conditions is 3.5 or higher. (Absorbance measurement conditions) • Sample to be measured: a hardened material obtained by heating the aforementioned liquid compression molding material at 150°C for 60 minutes. • Thickness of the sample to be measured: 260 μm. • Measurement wavelength: 1064 nm.