Curable resin composition, dry film, and cured product
TW202633956APending Publication Date: 2026-08-16TAIYO HOLDINGS CO LTD
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Patent Information
- Application Number
- TW114139898
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-10-25
- Filing Date
- 2025-10-16
- Publication Date
- 2026-08-16
Abstract
This invention provides a curable resin composition capable of forming a cured product with excellent adhesion to a substrate, and a dry film and a cured product obtained using the curable resin composition. One aspect of this invention is a curable resin composition. The aforementioned curable resin composition comprises: a resin having one or more of the groups selected from hydroxyl and carboxyl groups, a crosslinking agent, a photoacid generating agent, and a silicon-containing compound having two or more (meth)acrylic groups.
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