Curable resin composition, dry film, and cured product

TW202633956APending Publication Date: 2026-08-16TAIYO HOLDINGS CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW114139898
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-10-25
Filing Date
2025-10-16
Publication Date
2026-08-16
Patent Text Reader

Abstract

This invention provides a curable resin composition capable of forming a cured product with excellent adhesion to a substrate, and a dry film and a cured product obtained using the curable resin composition. One aspect of this invention is a curable resin composition. The aforementioned curable resin composition comprises: a resin having one or more of the groups selected from hydroxyl and carboxyl groups, a crosslinking agent, a photoacid generating agent, and a silicon-containing compound having two or more (meth)acrylic groups.
Need to check novelty before this filing date? Find Prior Art