Photosensitive resin composition, cured product, and semiconductor device

Abstract

A photosensitive resin composition comprising: a polyimide (A) containing a constituent unit represented by the following general formula (1); a polyfunctional (meth)acrylate (B); and a polymerization initiator (C). (In general formula (1), X represents a constituent unit (X) as a divalent organic group, Y represents a constituent unit (Y) as a tetravalent organic group, and the aforementioned constituent unit (X) contains a constituent unit (X-1) represented by the following general formula (x1).) (In general formula (x1), R1 independently represents an alkyl group having 1 to 4 carbon atoms, a and b independently represent integers from 0 to 3, and * represents a bond.) none

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