Negative photosensitive resin composition

TW202633959APending Publication Date: 2026-08-16DIC CORP
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Patent Information

Application Number
TW114143433
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-21
Filing Date
2025-11-07
Publication Date
2026-08-16
Patent Text Reader

Abstract

[Problem] To provide a photosensitive resin composition that can produce a hardened film with high visible light shielding even with reduced amounts of colorants such as carbon black. [Solution] A negative photosensitive resin composition containing the following components (A) to (C). (A) A phenolic varnish-type phenolic resin, wherein the molar ratio of structural units derived from cresol (a1), dihydroxynaphthalene (a2), benzaldehyde (a3), and salicylaldehyde (a4) [(a1):(a2):(a3):(a4)] is 1:0.25~4.0:0.25~4.0:0.25~4.0 / (B) Photosensitive agent / (C) Organic solvent. none
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