Negative photosensitive resin composition
TW202633959APending Publication Date: 2026-08-16DIC CORP
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Patent Information
- Application Number
- TW114143433
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-11-21
- Filing Date
- 2025-11-07
- Publication Date
- 2026-08-16
Abstract
[Problem] To provide a photosensitive resin composition that can produce a hardened film with high visible light shielding even with reduced amounts of colorants such as carbon black. [Solution] A negative photosensitive resin composition containing the following components (A) to (C). (A) A phenolic varnish-type phenolic resin, wherein the molar ratio of structural units derived from cresol (a1), dihydroxynaphthalene (a2), benzaldehyde (a3), and salicylaldehyde (a4) [(a1):(a2):(a3):(a4)] is 1:0.25~4.0:0.25~4.0:0.25~4.0 / (B) Photosensitive agent / (C) Organic solvent. none
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