Polyimide film

TW202633960APending Publication Date: 2026-08-16TOYOBO CO LTD
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Patent Information

Application Number
TW114146605
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-09-17
Filing Date
2025-11-28
Publication Date
2026-08-16
Patent Text Reader

Abstract

A polyimide film comprising a substrate layer containing polyimide resin and an easy-bond layer comprising a silane coupling agent and a surfactant disposed on at least one side of the substrate layer, wherein two polyimide films are bonded to the adhesive layer for testing in a manner in which the easy-bond layer contacts the adhesive layer for testing, and the peel strength retention rate after PCT treatment (121°C, 2 atm, 100% RH, 96 hours) is 40% or more. Peel strength retention rate (%) = peel strength after PCT / initial peel strength × 100. Initial peel strength: the value measured after the two polyimide films are bonded to the adhesive layer for testing.
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