Polyimide film
TW202633960APending Publication Date: 2026-08-16TOYOBO CO LTD
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Patent Information
- Application Number
- TW114146605
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-09-17
- Filing Date
- 2025-11-28
- Publication Date
- 2026-08-16
Abstract
A polyimide film comprising a substrate layer containing polyimide resin and an easy-bond layer comprising a silane coupling agent and a surfactant disposed on at least one side of the substrate layer, wherein two polyimide films are bonded to the adhesive layer for testing in a manner in which the easy-bond layer contacts the adhesive layer for testing, and the peel strength retention rate after PCT treatment (121°C, 2 atm, 100% RH, 96 hours) is 40% or more. Peel strength retention rate (%) = peel strength after PCT / initial peel strength × 100. Initial peel strength: the value measured after the two polyimide films are bonded to the adhesive layer for testing.
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