Multilayer polyimide film

Abstract

The multilayer polyimide film (10) comprises a non-thermoplastic polyimide layer (11) and a thermoplastic polyimide layer (12) disposed on at least one side of the non-thermoplastic polyimide layer (11). The thermoplastic polyimide contained in the thermoplastic polyimide layer (12) has a 1,3-bis(4-aminophenoxy)benzene residue as a diamine residue and a 3,3',4,4'-benzophenone tetracarboxylic dianhydride residue as a tetracarboxylic dianhydride residue. The coefficient of linear expansion of the thermoplastic polyimide layer (12) is 65.0 ppm / K or less. The tensile modulus of elasticity of the non-thermoplastic polyimide layer (11) is 5.0 GPa or more. The tensile stress of the non-thermoplastic polyimide layer (11) at 10% strain is 200 MPa or more.

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