Photosensitive resin composition, method for producing a cured pattern product, cured pattern product, and electronic component

TW202633967APending Publication Date: 2026-08-16HD MICROSYSTEMS LTD

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Patent Information

Application Number: TW115102314
Authority / Receiving Office: TW · TW
Patent Type: Applications
Current Assignee / Owner
Priority Date: 2025-01-22
Filing Date: 2026-01-21
Publication Date: 2026-08-16

Application Information

Patent Timeline

22 Jan 2025

Priority

21 Jan 2026

Application

TW115102314

16 Aug 2026

Publication

TW202633967A

IPC: C08G73/12; C08F2/06; C08F120/56; C08G73/10; C08G73/22; G03F7/028; G03F7/039; G03F7/16

Inventors: 四柳拡子

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Abstract

A photosensitive resin composition containing a resin that is at least one of a cyclized resin and a precursor of the cyclized resin, and a solvent, wherein the solvent includes a solvent A and a solvent B having a vapor pressure at

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