Resin composition and molded body
TW202633972APending Publication Date: 2026-08-16KURARAY CO LTD
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Patent Information
- Application Number
- TW114139928
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-10-16
- Filing Date
- 2025-10-16
- Publication Date
- 2026-08-16
Abstract
A resin composition and a molded body thereof, wherein the block copolymer (II) comprises block copolymer (II-1) and block copolymer (II-2), wherein the block copolymer (II-1) is a triblock copolymer having a bond morphology of polymer block (A1)-polymer block (B1)-polymer block (A1'), the block copolymer (II-2) is a diblock copolymer having a bond morphology of polymer block (A2)-polymer block (B2), wherein the polymer blocks (A1), (A1') and (A2) are polymer blocks containing structural units derived from aromatic vinyl compounds, and wherein the polymer blocks (B1) and (B2) are polymer blocks containing structural units derived from conjugated diene compounds.
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