Resin composition and molded body

TW202633972APending Publication Date: 2026-08-16KURARAY CO LTD
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Patent Information

Application Number
TW114139928
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-10-16
Filing Date
2025-10-16
Publication Date
2026-08-16
Patent Text Reader

Abstract

A resin composition and a molded body thereof, wherein the block copolymer (II) comprises block copolymer (II-1) and block copolymer (II-2), wherein the block copolymer (II-1) is a triblock copolymer having a bond morphology of polymer block (A1)-polymer block (B1)-polymer block (A1'), the block copolymer (II-2) is a diblock copolymer having a bond morphology of polymer block (A2)-polymer block (B2), wherein the polymer blocks (A1), (A1') and (A2) are polymer blocks containing structural units derived from aromatic vinyl compounds, and wherein the polymer blocks (B1) and (B2) are polymer blocks containing structural units derived from conjugated diene compounds.
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