Chemical-mechanical planarization pads and methods

TW202633973APending Publication Date: 2026-08-16ENTEGRIS INC
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Patent Information

Application Number
TW114150659
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-23
Filing Date
2025-12-23
Publication Date
2026-08-16

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Abstract

Described are pads and methods used in chemical-mechanical polishing (also referred to as chemical-mechanical planarization) of microelectronic substrates, the pads having a polishing surface that includes rigid sections and compliant sections.
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