Resin sheet, container, carrier tape, and packaging for electronic component

TW202633977APending Publication Date: 2026-08-16DENKA CO LTD
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Patent Information

Application Number
TW115112338
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2020-08-05
Filing Date
2021-06-21
Publication Date
2026-08-16

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    Figure TWG2TA001073517_003
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Abstract

J, and in a stress-strain curve obtained by tensile testing, exhibits a value for the integral of the strain from the origin point to the fracture point that does not exceed
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